Semiconductor Industry
Tool Qualification
Mechanical and thermal hardware design
FEA and validation
Project management
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Qualify new processing tools for copy exact processing products for High Volume Manufacturing (HVM). Conduct DEO’s and use Statistical analysis to qualify tools.
Analyze and characterize properties of small features and implement analysis into robust reliable designs.
Define PCB board Keep-Out-Zones (KOZ). Define PCB board finish with required features for mechanical hardware and socket requirements.
Enable pathfinding and bench-top concept testing with creative fast solutions for OEM customers.
Validation platform support and enabling with custom heatsink solutions.
3D CAD expert in Creo, Solidwords, etc with GD&T experience as we as DFM.
Direct OEM validation support to enable new products through form factor socket and validation heatsink designs.
Project lead for validation socket and thermal solutions. oversee and drive multiple mechanical and thermal validation design projects like the Aurora super computer to ensure quality and on-time delivery.
Perform material FA using tools like SEM to determine impact of new tool processes and determine FM from the process flow.
Design targeted thermal cycling tools with temperature ranges from -40C to 125C for parts as small as 5mm x 5mm to parts that are 50mm x 50mm.
Qualify high power laser processing tools. Design safety enclosures and systems to make Class 4 power laser systems to Class 4 systems. Create copy exact global processing recipes for use across multiple tools all over the world.
Design active or passive heatsinks for small and large devices for validation and test environment.
CPU thermal automation test setup design qualification.
Bench-top thermal validation hardware design for CPU stress testing.